Odisha to Host India's First Advanced 3D Semiconductor Packaging Unit

The foundation stone for India's first advanced 3D semiconductor packaging unit has been laid at Info Valley, Odisha. The project involves an investment of ₹2,000 crore ForumIAS and marks a major step in India's push to become self-reliant in semiconductor manufacturing.
 

Key points to remember:
 

• Location: Info Valley, Odisha
• Investment: ₹2,000 crore
• Significance: India's first advanced 3D semiconductor packaging unit
• Related to India's broader semiconductor mission to reduce dependence on imports
• Relevant ministry: Ministry of Electronics and Information Technology (MeitY)